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Shimane Masuda Electronics CO., LTD./Semiconductor Assembly Process Development
Semiconductor Assembly Process Development

SIP/HF/Batch Process

SIP

Keyword Keyword Keyword Keyword
  ● Stack SIP  
 
Stack Die Bonding of Si & GaAs chips
  
     
  ● Pitch  
 
Stabilization of narrow pitch mounting (0402 mounting, 100μ-pitch mounting)
  
     
  ● Low height  
 
Development of the thinnest mold PKG (0.3mm thick)
  
       
  SPI    
       
       

HF

キーワード キーワード キーワード キーワード
  ● Test technology of
W-LAN, Wi-MAX.HSDPA		 HF  
     
  ● Test technology of millimeter wave  
     
  高周波の詳細  
       
       

Advanced Process

Semiconductor Assembly Process Development Semiconductor Assembly Process Development Semiconductor Assembly Process Development Semiconductor Assembly Process Development
  ● Low height mold PKG    
 
Vacuum mold” process
    
       
  ● LTCC  
 
“Transfer molding” process
    
       
  ● Fe.Cu.Ceramics Substrate    
 
“Saw singulation” process